特性

High-Performance Static CMOS Technology

    Up to 150 MHz for TC = –55°C to 125°C

    and Up to 100 MHZ for TC = 210°C

    1.9-V Core, 3.3-V I/O Design

High-Performance 32-Bit CPU

    IEEE-754 Single-Precision Floating-Point Unit (FPU))

    16 × 16 and 32 × 32 MAC Operations

    16 × 16 Dual MAC

    Harvard Bus Architecture

    Fast Interrupt Response and Processing

    Unified Memory Programming Model

    Code-Efficient (in C/C++ and Assembly)

Six Channel DMA Controller (for ADC, McBSP,

ePWM, XINTF, and SARAM)

16-bit or 32-bit External Interface (XINTF)

    Over 2M × 16 Address Reach

On-Chip Memory

    256K × 16 Flash, 34K × 16 SARAM

    1K × 16 OTP ROM

Boot ROM (8K x 16)

    With Software Boot Modes (via SCI, SPI, CAN,

    I2C, McBSP, XINTF, and Parallel I/O)

    Standard Math Tables

Clock and System Control

    Dynamic PLL Ratio Changes Supported

    On-Chip Oscillator

    Watchdog Timer Module

GPIO0 to GPIO63 Pins Can Be Connected to One

of the Eight External Core Interrupts

Peripheral Interrupt Expansion (PIE) Block

That Supports All 58 Peripheral Interrupts

128-Bit Security Key/Lock

    Protects Flash/OTP/RAM Blocks

    Prevents Firmware Reverse Engineering

Enhanced Control Peripherals

    Up to 18 PWM Outputs

    Up to 6 HRPWM Outputs With 150 ps MEP Resolution

    Up to 6 Event Capture Inputs

    Up to 2 Quadrature Encoder Interfaces

    Up to 8 32-bit/Nine 16-bit Timers

Three 32-Bit CPU Timers

Serial Port Peripherals

    Up to 2 CAN Modules

    Up to 3 SCI (UART) Modules

    Up to 2 McBSP Modules (Configurable as SPI)

    One SPI Module

    One Inter-Integrated-Circuit (I2C) Bus

12-Bit ADC, 16 Channels

    80-ns Conversion Rate

    2 × 8 Channel Input Multiplexer

    Two Sample-and-Hold

    Single/Simultaneous Conversions

    Internal or External Reference

Up to 88 Individually Programmable, Multiplexed

GPIO Pins With Input Filtering

JTAG Boundary Scan Support IEEE Standard 1149.1-1990

Standard Test Access Port and Boundary Scan Architecture

Advanced Emulation Features

    Analysis and Breakpoint Functions

    Real-Time Debug via Hardware

Development Support Includes

    ANSI C/C++ Compiler/Assembler/Linker

    Code Composer Studio IDE

    DSP/BIOS

    Digital Motor Control and Digital Power

    Software Libraries

Low-Power Modes and Power Savings

    IDLE, STANDBY, HALT Modes Supported

    Disable Individual Peripheral Clocks

Package Option

    Ceramic Pin Grid Array (GB)

    HLQFP (PTP)

Temperature Range:

    GB Package: –55°C to 210°C (GB)

    PTP Package: –55°C to 150°C (PTP)

APPLICATIONS

    Controlled Baseline

    One Assembly/Test Site

    One Fabrication Site

    Available in Extreme (–55°C/210°C)

    Temperature Range(1)

    Extended Product Life Cycle

    Extended Product-Change Notification

    Product Traceability

    Texas Instruments high temperature products utilize

    highly optimized silicon (die) solutions with design

    and process enhancements to maximize performance over

    extended temperatures.

描述

The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.

Throughout this document, the device is abbreviated as F28335.