Wire bonders attach a piece of semiconductor die onto its plastic or ceramic packaging. This is a very precision operation where, the package and die must line up to ensure a good electrical contact. Using an image sensor to correctly position the die, the information from the sensor is sent along the LVDS channel to a DSP. The DSP then sends the information to a die positioning table to line up the die and packaging. National offers a variety of precision operational amplifiers and DACs to handle this task. In addition power management, temperature sensors and operator display ensures that this task operates safely and efficiently.

Component Highlights
*LVDS - high toggle rates allow serialization of large amounts of parallel data for efficient transmission over a single 100 ohm transmission line, with reduced emissions and drastically improved immunity to external interference.
*Operational amplifiers - Rail-to-rail input and output amplifiers maximize the signal range.
*D/A converter - with high resolution and sampling rates, DACs easily interface with microprocessors and TTL logic.
*Ethernet - Ethernet devices consume low power and are available in a wide range of speeds from 10/100 MB/s to 1Gbps
1 Power
LP2997
LP38691
LP38693
2 LVDS
DS92LV1021A
DS92LV1023E
DS92LV1260
3 Display
ADCS9888CVH-170
ADCS9888CVH-140
4 DAC
DAC081S101CIMK
DAC081S101CIMKX
DAC081S101CIMM
5 Amp
LMH6639
LMH6642
LMH6643
6 Ethernet
DP83816AVNG
7 Temp Sensor
LM26
LM27
8 Power
LM25005
LM25007
LM25010