CERAMIC CHIP CAPACITORS
FEATURES
鈥?C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
鈥?10, 16, 25, 50, 100 and 200 Volts
鈥?Standard End Metalization: Tin-plate over nickel
barrier
鈥?Available Capacitance Tolerances: 卤0.10 pF; 卤0.25
pF; 卤0.5 pF; 卤1%; 卤2%; 卤5%; 卤10%; 卤20%; and
+80%-20%
鈥?Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
鈥?RoHS Compliant
CAPACITOR OUTLINE DRAWINGS
W
T
S
ELECTRODES
L
B
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
DIMENSIONS鈥擬ILLIMETERS AND (INCHES)
SIZE CODE
EIA
SIZE
SIZE
CODE
METRIC
(Ref only)
CODE
SIZE CODE
0402*
1005
EIA
METRIC
L - LENGTH
0.6 (.024) 卤 .03 (.001)
1.0 (.04) 卤 .05 (.002)
1.6 (.063) 卤 .15 (.006)
2.0 (.079) 卤 .20 (.008)
3.2 (.126) 卤 .20 (.008)
3.2 (.126) 卤 .20 (.008)
4.5 (.177) 卤 .30 (.012)
4.5 (.177) 卤 .30 (.012)
5.6 (.220) 卤 .40 (.016)
5.6 (.220) 卤 .40 (.016)
W - WIDTH
0.3 卤 (.012) 卤 .03 (.001)
0.5 (.02) 卤 .05 (.002)
0.8 (.032) 卤 .15 (.006)
1.25 (.049) 卤 .20 (.008)
1.6 (.063) 卤 .20 (.008)
2.5 (.098) 卤 .20 (.008)
3.2 (.126) 卤 .30 (.012)
6.4 (.252) 卤 .40 (.016)
5.0 (.197) 卤 .40 (.016)
6.3 (.248) 卤 .40 (.016)
T
THICKNESS
B - BANDWIDTH
0.15 (.006) 卤 .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) 卤 .15 (.006)
0.50 (.02) 卤 .25 (.010)
0.50 (.02) 卤 .25 (.010)
0.50 (.02) 卤 .25 (.010)
0.60 (.024) 卤 .35 (.014)
0.60 (.024) 卤 .35 (.014)
0.60 (.024) 卤 .35 (.014)
0.60 (.024) 卤 .35 (.014)
S
SEPARATION
minimum
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
or
0201*
0603*
0402*
0805*
0603
1206*
0805*
1210*
1206*
1812
2220
2225
1812
0603
1608
1005
2012
1608
3216
2012
3225
3216
4532
4564
5650
5664
4532
4564
5650
5664
1210*
1825*
1825*
2220
2225
3225
See page 78
for thickness
dimensions.
Solder Wave +
or
Solder Reflow
Solder
Reflow
Solder Reflow
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
CAPACITOR ORDERING INFORMATION
(Standard Chips - For
C 0805 C 103 K 5 R A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B 鈥?卤0.10pF J 鈥?卤5%
C 鈥?卤0.25pF K 鈥?卤10%
D 鈥?卤0.5pF
M 鈥?卤20%
F 鈥?卤1%
P 鈥?(GMV) 鈥?special order only
G 鈥?卤2%
Z 鈥?+80%, -20%
72
Military see page
87)
END METALLIZATION
C-Standard (Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G 鈥?C0G (NP0) (卤30 PPM/掳C)
R 鈥?X7R (卤15%) (-55掳C + 125掳C)
P鈥?X5R (卤15%) (-55掳C + 85掳C)
U 鈥?Z5U (+22%, -56%) (+10掳C + 85掳C)
V 鈥?Y5V (+22%, -82%) (-30掳C + 85掳C)
VOLTAGE
1 - 100V
3 - 25V
2 - 200V
4 - 16V
5 - 50V
8 - 10V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)
7 - 4V
9 - 6.3V
漏KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Ceramic Surface Mount
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