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JANTX1N3031B Datasheet

  • JANTX1N3031B

  • Microsemi Corporation [1 WATT METAL CASE ZENER DIODES]

  • 192.14KB

  • MICROSEMI

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1N3016B thru 1N3051B
1 WATT METAL CASE ZENER DIODES
SCOTTSDALE DIVISION
DESCRIPTION
This well established zener diode series for the 1N3016 thru 1N3051
JEDEC registration in the metal case DO-13 package provides a glass
hermetic seal for 6.8 to 200 volts. It is also well suited for high-reliability
applications where it is available in JAN, JANTX, and JANTXV military
qualifications. Lower voltages are also available in the 1N3821 thru
1N3830 series (3.3 V to 7.5 V) in the same package (see separate data
sheet). Microsemi also offers numerous other Zener diode products for a
variety of other packages including surface mount.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-13
IMPORTANT:
For the most current data, consult
MICROSEMI鈥檚
website:
http://www.microsemi.com
FEATURES
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Zener Voltage Range: 6.8V to 200V
Hermetically sealed DO-13 metal package
Internally solder-bonded construction.
Also available in JAN, JANTX, JANTXV
qualifications per MIL-PRF19500/115 by adding the
JAN, JANTX, or JANTXV prefixes to part numbers
for desired level of screening, e.g. JANTX1N3016B,
JANTXV1N3051B, etc.
Surface mount also available with 1N3016BUR-1
thru 1N3051BUR-1 series on separate data sheet
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 6.8 to 200 V
Tight voltage tolerances available
Low reverse (leakage) currents
Nonsensitive to ESD
Hermetically sealed metal package
Inherently radiation hard as described in Microsemi
MicroNote 050
鈥?/div>
MAXIMUM RATINGS
鈥?/div>
鈥?/div>
Operating Junction and Storage Temperatures:
-65
o
C to +175
o
C
THERMAL RESISTANCE: 50
o
C/W* junction to lead
at 0.375 inches (10 mm) from body or 110
o
C/W
junction to ambient when leads are mounted on FR4
PC board with 4 mm
2
copper pads (1 oz) and track
width 1 mm, length 25 mm
DC Power Dissipation
*
: 1.0 Watt at T
L
< +125
o
C 3/8鈥?/div>
(10 mm) from body or 1.0 Watts at T
L
< +65
o
C when
mounted on FR4 PC board as described for thermal
resistance above (also see Fig 1)
Forward Voltage @ 200 mA: 1.5 Volts.
Solder Temperatures: 260
o
C for 10 s (maximum)
鈥?/div>
鈥?/div>
MECHANICAL AND PACKAGING
CASE: DO-13 (DO-202AA), welded, hermetically
sealed metal and glass
FINISH: All external surfaces are Tin-Lead (Pb/Sn)
plated and solderable per MIL-STD-750 method
2026
POLARITY: Cathode connected case.
WEIGHT: 1.4 grams.
Tape & Reel option: Standard per EIA-296 (add
鈥淭R鈥?suffix to part number)
See package dimensions on last page
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
1N3016B 鈥?1N3051B
鈥?/div>
鈥?/div>
*
For further mounting reference, thermal resistance from junction to metal case may be reduced to
<
20
o
C/W
when mounting DO-13 metal case directly on heat sink.
Copyright
铮?/div>
2003
11-03-2003 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

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