鈥?/div>
Pb鈭扚ree Packages are Available*
16
16
1
PDIP鈭?6
P SUFFIX
CASE 648
1
MC10H113P
AWLYYWWG
10H113
ALYWG
SOEIAJ鈭?6
CASE 966
1 20
20 1
PLLC鈭?0
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
10H113G
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb鈭扚ree Package
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
漏
Semiconductor Components Industries, LLC, 2006
February, 2006
鈭?/div>
Rev. 8
1
Publication Order Number:
MC10H113/D
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