V鈭?/div>
DOUT2
RIN2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
DESCRIPTION/ORDERING INFORMATION
ORDERING INFORMATION
T
A
SOIC 鈥?D
SOIC 鈥?DW
鈥?掳C to 70掳C
SSOP 鈥?DB
TSSOP 鈥?PW
SOIC 鈥?D
SOIC 鈥?DW
鈥?0掳C to 85掳C
SSOP 鈥?DB
TSSOP 鈥?PW
(1)
(2)
PACKAGE
(1) (2)
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Tube of 80
Reel of 2000
Tube of 90
Reel of 2000
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Tube of 80
Reel of 2000
Tube of 90
Reel of 2000
ORDERABLE PART NUMBER
MAX3232ECD
MAX3232ECDR
MAX3232ECDW
MAX3232ECDWR
MAX3232ECDB
MAX3232ECDBR
MAX3232ECPW
MAX3232ECPWR
MAX3232EID
MAX3232EIDR
MAX3232EIDW
MAX3232EIDWR
MAX3232EIDB
MAX3232EIDBR
MAX3232EIPW
MAX3232EIPWR
TOP-SIDE MARKING
MAX3232EC
MAX3232EC
MP232EC
MP232EC
MAX3232EI
MAX3232EI
MP232EI
MP232EI
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at
www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright 漏 2005鈥?007, Texas Instruments Incorporated