| MP2303ADN-LF-Z |
2 3 4 5 6
PH CONNECTOR
2.0mm pitch/Disconnectable Crimp style connectors
Emboss Tape
End face of wafer
on the mating side
Circuit No.1
End face of wafer
on the mating side
Circuit No.1
This is a thin, low-profile 2.0mm pitch
connector 8.0mm in height after mounting
and 4.5mm in width. It is designed to meet
the demand for high-density connection of
internal wires to printed circuit boards. It is
compact, highly reliable and low in cost.
? Reliable contact
? Fully shrouded header
? Printed circuit board retention mechanism
? Surface mount model (SMT)
Specifications –––––––––––––––––––
? Current rating: 2A AC, DC (AWG #24)
? Voltage rating: 100V AC, DC
? Temperature range: -25?C to +85?C
(including temperature rise in applying
electrical current)
? Contact resistance: Initial value/ 10m ? max.
After environmental testing/ 20m ? max.
? Insulation resistance: 1,000M ? min.
? Withstanding voltage: 800V AC/ minute
? Applicable wire: AWG #32 to #24
? Applicable PC board thickne |
116.17K |
|
 |
| MP2303ADN-LF-Z_114 |
2 3 4 5 6
PH CONNECTOR
2.0mm pitch/Disconnectable Crimp style connectors
Emboss Tape
End face of wafer
on the mating side
Circuit No.1
End face of wafer
on the mating side
Circuit No.1
This is a thin, low-profile 2.0mm pitch
connector 8.0mm in height after mounting
and 4.5mm in width. It is designed to meet
the demand for high-density connection of
internal wires to printed circuit boards. It is
compact, highly reliable and low in cost.
? Reliable contact
? Fully shrouded header
? Printed circuit board retention mechanism
? Surface mount model (SMT)
Specifications –––––––––––––––––––
? Current rating: 2A AC, DC (AWG #24)
? Voltage rating: 100V AC, DC
? Temperature range: -25?C to +85?C
(including temperature rise in applying
electrical current)
? Contact resistance: Initial value/ 10m ? max.
After environmental testing/ 20m ? max.
? Insulation resistance: 1,000M ? min.
? Withstanding voltage: 800V AC/ minute
? Applicable wire: AWG #32 to #24
? Applicable PC board thickne |
116.17K |
|
|
