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STM32F103RCT6 April 2011 Doc ID 14611 Rev 8 1/130 1 STM32F103xC STM32F103xD STM32F103xE High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Features ■ Core: ARM 32-bit Cortex?-M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access – Single-cycle multiplication and hardware division ■ Memories – 256 to 512 Kbytes of Flash memory – up to 64 Kbytes of SRAM – Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories – LCD parallel interface, 8080/6800 modes ■ Clock, reset and supply management – 2.0 to 3.6 V application supply and I/Os – POR, PDR, and programmable voltage detector (PVD) – 4-to-16 MHz crystal oscillator – Internal 8 MHz factory-trimmed RC – Internal 40 kHz RC with calibration – 32 kHz oscillator for RTC with calibration ■ Low power – Sleep, Stop and Standby modes –V BAT supply for RTC and ba 1930.39K
STM32F103RCT6 April 2011 Doc ID 14611 Rev 8 1/130 1 STM32F103xC STM32F103xD STM32F103xE High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Features ■ Core: ARM 32-bit Cortex?-M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access – Single-cycle multiplication and hardware division ■ Memories – 256 to 512 Kbytes of Flash memory – up to 64 Kbytes of SRAM – Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories – LCD parallel interface, 8080/6800 modes ■ Clock, reset and supply management – 2.0 to 3.6 V application supply and I/Os – POR, PDR, and programmable voltage detector (PVD) – 4-to-16 MHz crystal oscillator – Internal 8 MHz factory-trimmed RC – Internal 40 kHz RC with calibration – 32 kHz oscillator for RTC with calibration ■ Low power – Sleep, Stop and Standby modes –V BAT supply for RTC and ba 1933.13K
STM32F103RCT6_716 April 2011 Doc ID 14611 Rev 8 1/130 1 STM32F103xC STM32F103xD STM32F103xE High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Features ■ Core: ARM 32-bit Cortex?-M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access – Single-cycle multiplication and hardware division ■ Memories – 256 to 512 Kbytes of Flash memory – up to 64 Kbytes of SRAM – Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories – LCD parallel interface, 8080/6800 modes ■ Clock, reset and supply management – 2.0 to 3.6 V application supply and I/Os – POR, PDR, and programmable voltage detector (PVD) – 4-to-16 MHz crystal oscillator – Internal 8 MHz factory-trimmed RC – Internal 40 kHz RC with calibration – 32 kHz oscillator for RTC with calibration ■ Low power – Sleep, Stop and Standby modes –V BAT supply for RTC and ba 1933.13K
STM32F103RCT6_716 April 2011 Doc ID 14611 Rev 8 1/130 1 STM32F103xC STM32F103xD STM32F103xE High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Features ■ Core: ARM 32-bit Cortex?-M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access – Single-cycle multiplication and hardware division ■ Memories – 256 to 512 Kbytes of Flash memory – up to 64 Kbytes of SRAM – Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories – LCD parallel interface, 8080/6800 modes ■ Clock, reset and supply management – 2.0 to 3.6 V application supply and I/Os – POR, PDR, and programmable voltage detector (PVD) – 4-to-16 MHz crystal oscillator – Internal 8 MHz factory-trimmed RC – Internal 40 kHz RC with calibration – 32 kHz oscillator for RTC with calibration ■ Low power – Sleep, Stop and Standby modes –V BAT supply for RTC and ba 1930.39K
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