74LVT2244 鈥?74LVTH2244 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs and 25: Series Resistors in
the Outputs
July 1999
Revised March 2005
74LVT2244 鈥?74LVTH2244
Low Voltage Octal Buffer/Line Driver
with 3-STATE Outputs
and 25: Series Resistors in the Outputs
General Description
The LVT2244 and LVTH2244 are octal buffers and line
drivers designed to be employed as memory address driv-
ers, clock drivers and bus oriented transmitters or receivers
which provides improved PC board density. The equivalent
25
:
-Series resistors helps reduce output overshoot and
undershoot.
The LVTH2244 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
These octal buffers and line drivers are designed for low-
voltage (3.3V) V
CC
applications, but with the capability to
provide a TTL interface to a 5V environment. The LVT2244
and LVTH2244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
Features
s
Input and output interface capability to systems at
5V V
CC
s
Equivalent 25
:
-Series resistors on outputs
s
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH2244),
also available without bushold feature (74LVT2244).
s
Live insertion/extraction permitted
s
Power Up/Down high impedance provides glitch-free
bus loading
s
Outputs source/sink
12 mA/
12 mA
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human-body model
!
2000V
Machine model
!
200V
Charged-device model
!
1000V
Ordering Code:
Order Number
74LVT2244WM
74LVT2244SJ
74LVT2244MTC
74LVT2244MTCX_NL
(Note 1)
74LVTH2244WM
74LVTH2244SJ
74LVTH2244MTC
74LVTH2244MTCX_NL
(Note 1)
Package
Number
M20B
M20D
MTC20
MTC20
M20B
M20D
MTC20
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter 鈥淴鈥?to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1:
鈥淿NL鈥?indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
漏 2005 Fairchild Semiconductor Corporation
DS012170
www.fairchildsemi.com