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ISL5861
Data Sheet
August 2004
FN6008.2
12-bit, +3.3V, 130/210+MSPS, High Speed
D/A Converter
The ISL5861 is a 12-bit, 130/210+MSPS (Mega Samples
Per Second), CMOS, high speed, low power, D/A (digital to
analog) converter, designed specifically for use in high
performance communication systems such as base
transceiver stations utilizing 2.5G or 3G cellular protocols.
This device complements the ISL5x61 family of high speed
converters, which include 10, 12, and 14-bit devices.
Features
鈥?Speed Grades . . . . . . . . . . . . . . . . 130M and 210+MSPS
鈥?Low Power . . . . . 103mW with 20mA Output at 130MSPS
鈥?Adjustable Full Scale Output Current . . . . . 2mA to 20mA
鈥?+3.3V Power Supply
鈥?3V LVCMOS Compatible Inputs
鈥?Excellent Spurious Free Dynamic Range
(73dBc to Nyquist, f
S
= 130MSPS, f
OUT
= 10MHz)
鈥?UMTS Adjacent Channel Power =70dB at 19.2MHz
鈥?EDGE/GSM SFDR = 90dBc at 11MHz in 20MHz Window
Ordering Information
PART
NUMBER
ISL5861IB
ISL5861IBZ
(See Note)
ISL5861IA
ISL5861IAZ
(See Note)
ISL5861/2IB
ISL5861/2IBZ
(See Note)
ISL5861/2IA
ISL5861/2IAZ
(See Note)
ISL5861EVAL1
TEMP.
RANGE
(
o
C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
25
PACKAGE
28 Ld SOIC
28 Ld SOIC
(Pb-free)
PKG.
DWG. #
M28.3
M28.3
CLOCK
SPEED
130MHz
130MHz
鈥?Pin compatible, 3.3V, Lower Power Replacement For The
AD9752 and HI5860
鈥?/div>
Pb-free available
Applications
鈥?Cellular Infrastructure - Single or Multi-Carrier: IS-136,
IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA
鈥?BWA Infrastructure
鈥?Medical/Test Instrumentation
鈥?Wireless Communication Systems
鈥?High Resolution Imaging Systems
鈥?Arbitrary Waveform Generators
28 Ld TSSOP M28.173 130MHz
28 Ld TSSOP M28.173 130MHz
(Pb-free)
28 Ld SOIC
28 Ld SOIC
(Pb-free)
M28.3
M28.3
210MHz
210MHz
28 Ld TSSOP M28.173 210MHz
28 Ld TSSOP M28.173 210MHz
(Pb-free)
SOIC Evaluation Platform 210MHz
Pinout
ISL5861
TOP VIEW
D11 (MSB) 1
D10 2
D9 3
D8 4
D7 5
D6 6
D5 7
D4 8
D3 9
D2 10
D1 11
D0 (LSB) 12
DCOM 13
DCOM 14
28 CLK
27 DV
DD
26 DCOM
25 NC
24 AV
DD
23 COMP
22 IOUTA
21 IOUTB
20 ACOM
19 NC
18 FSADJ
17 REFIO
16 REFLO
15 SLEEP
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
|
Intersil and Design is a trademark of Intersil Americas Inc.
Copyright 漏 Intersil Americas Inc. 2001, 2004, All Rights Reserved
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