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SN74LVC1G66 Datasheet

  • SN74LVC1G66

  • SINGLE BILATERAL ANALOG SWITCH

  • 228.00KB

  • 20页

  • TI

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SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
SCES323H 鈭?JUNE 2001 鈭?REVISED SEPTEMBER 2003
D
Available in the Texas Instruments
D
D
D
D
D
D
D
D
D
NanoStar铮?and NanoFree铮?Packages
1.65-V to 5.5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 0.8 ns at 3.3 V
High On-Off Output Voltage Ratio
High Degree of Linearity
High Speed, Typically 0.5 ns
(V
CC
= 3 V, C
L
= 50 pF)
Low On-State Resistance, Typically
鈮?.5 鈩?/div>
(V
CC
= 4.5 V)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
鈭?2000-V Human-Body Model (A114-A)
鈭?200-V Machine Model (A115-A)
鈭?1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
A
B
GND
1
2
3
5
4
V
CC
C
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND
B
A
3 4
2
1 5
C
V
CC
description/ordering information
This single analog switch is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
ORDERING INFORMATION
TA
PACKAGE鈥?/div>
NanoStar铮?鈭?WCSP (DSBGA)
0.17-mm Small Bump 鈭?YEA
NanoFree铮?鈭?WCSP (DSBGA)
0.17-mm Small Bump 鈭?YZA (Pb-free)
鈭?0掳C to 85掳C
NanoStar铮?鈭?WCSP (DSBGA)
0.23-mm Large Bump 鈭?YEP
NanoFree铮?鈭?WCSP (DSBGA)
0.23-mm Large Bump 鈭?YZP (Pb-free)
Reel of 3000
SOT (SOT-23) 鈭?DBV
鈭?0掳C to 85掳C
SOT (SC-70) 鈭?DCK
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
SN74LVC1G66YEPR
SN74LVC1G66YZPR
SN74LVC1G66DBVR
SN74LVC1G66DBVT
SN74LVC1G66DCKR
SN74LVC1G66DCKT
C6_
C66_
ORDERABLE
PART NUMBER
SN74LVC1G66YEAR
SN74LVC1G66YZAR
_ _ _C6_
TOP-SIDE
MARKING鈥?/div>
鈥?Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
鈥?DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
鈥?/div>
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
铮?/div>
2003, Texas Instruments Incorporated
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
1

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