74VCX16601 Low Voltage 18-Bit Universal Bus Transceivers with 3.6V Tolerant Inputs and Outputs
March 1998
Revised October 2004
74VCX16601
Low Voltage 18-Bit Universal Bus Transceivers
with 3.6V Tolerant Inputs and Outputs
General Description
The VCX16601 is an 18-bit universal bus transceiver which
combines D-type latches and D-type flip-flops to allow data
flow in transparent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable
(OEAB and OEBA), latch-enable (LEAB and LEBA), and
clock (CLKAB and CLKBA) inputs. The clock can be con-
trolled by the clock-enable (CLKENAB and CLKENBA)
inputs. For A-to-B data flow, the device operates in the
transparent mode when LEAB is HIGH. When LEAB is
LOW, the A data is latched if CLKAB is held at a HIGH-to-
LOW logic level. If LEAB is LOW, the A bus data is stored
in the latch/flip-flop on the LOW-to-HIGH transition of
CLKAB. When OEAB is LOW, the outputs are active. When
OEAB is HIGH, the outputs are in the high-impedance
state.
Data flow for B to A is similar to that of A to B but uses
OEBA, LEBA, CLKBA and CLKENBA.
The VCX16601 is designed for low voltage (1.4V to 3.6V)
V
CC
applications with I/O capability up to 3.6V.
The VCX16601 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
s
1.4V to 3.6V V
CC
supply operation
s
3.6V tolerant inputs and outputs
s
t
PD
(A to B, B to A)
2.9 ns max for 3.0V to 3.6V V
CC
s
Power-down high impedance inputs and outputs
s
Supports live insertion/withdrawal (Note 1)
s
Static Drive (I
OH
/I
OL
)
卤
24 mA @ 3.0V V
CC
s
Uses patented noise/EMI reduction circuitry
s
Latchup performance exceeds 300 mA
s
ESD performance:
Human body model
>
2000V
Machine model
>
200V
s
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Note 1:
To ensure the high-impedance state during power up or power
down, OE should be tied to V
CC
through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Order Number
74VCX16601GX
(Note 2)
74VCX16601MTD
(Note 3)
Package Number
BGA54A
(Preliminary)
MTD56
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 2:
BGA package available in Tape and Reel only.
Note 3:
Devices also available in Tape and Reel. Specify by appending the suffix letter 鈥淴鈥?to the ordering code.
漏 2004 Fairchild Semiconductor Corporation
DS500126
www.fairchildsemi.com
1
2
3
4
5
6
7
8
9
10
11
