RECTRON
SEMICONDUCTOR
TECHNICAL SPECIFICATION
FSM101
THRU
FSM107
SURFACE MOUNT GLASS PASSIVATED
FAST RECOVERY SILICON RECTIFIER
VOLTAGE RANGE 50 to 1000 Volts CURRENT 1.0 Ampere
FEATURES
*
*
*
*
*
*
*
Fast switching
Glass passivated device
Ideal for surface mounted applications
Low leakage current
Metallurgically bonded construction
Mounting position: Any
Weight: 0.015 gram
MELF
MECHANICAL DATA
* Epoxy : Device has UL flammability classification 94V-0
.205 (5.2)
.190 (4.8)
SOLDERABLE
ENDS
.028 (.60)
.018 (.46)
.106 (2.7)
.095 (2.4)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS
(At T
A
= 25
o
C unless otherwise noted)
RATINGS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
o
Maximum Average Forward Rectified Current at T
A
= 55 C
SYMBOL
V
RRM
V
RMS
V
DC
I
O
I
FSM
(Note 2) R胃
JL
(Note 3) R胃
JA
C
J
T
J
, T
STG
FSM101 FSM102 FSM103 FSM104 FSM105 FSM106 FSM107 UNITS
50
35
50
100
70
100
200
140
200
400
280
400
1.0
30
30
75
15
-65 to + 175
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amps
Amps
0
0
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
Maximum Thermal Resistance
Typical Junction Capacitance (Note 1)
Operating and Storage Temperature Range
ELECTRICAL CHARACTERISTICS
(At T
A
= 25
o
C unless otherwise noted)
CHARACTERISTICS
Maximum Forward Voltage at 1.0A DC
o
Maximum Full Load Reverse Current,Full cycle Average at T
A
= 55 C
Maximum Average Reverse Current at
Rated DC Blocking Voltage
Maximum Reverse Recovery Time (Note 4)
@T
A
= 25 C
o
@T
A
= 125 C
o
C/ W
C/ W
pF
0
C
SYMBOL
V
F
I
R
trr
FSM101 FSM102 FSM103 FSM104 FSM105 FSM106 FSM107 UNITS
1.3
50
5.0
100
150
250
500
Volts
uAmps
uAmps
uAmps
nSec
2001-4
NOTES : 1. Measured at 1.0 MHz and applied average voltage of 4.0VDC
2. Thermal resistance junction to terminal 6.0mm
2
copper pads to each terminal.
3. Thermal resistance junction to ambient, 6.0mm
2
copper pads to each terminal.
4. Test Conditions: I
F
= 0.5A, I
R
= -1.0A, I
RR
= -0.25A
1
2
