鈻?/div>
Memories
鈥?Up to 256+16 Kbytes Flash memory (100,000
cycles endurance, 20 yrs retention)
鈥?Up to 64 Kbytes RAM
鈥?External Memory Interface (EMI) for up to 4
banks of SRAM, Flash, ROM.
鈥?Multi-boot capability
Clock, Reset and Supply Management
鈥?3.3V application supply and I/O interface
鈥?Internal 1.8V voltage regulator for core supply
鈥?0 to 16 MHz external main oscillator
鈥?32 kHz external backup oscillator
鈥?Embedded PLL for CPU clock
鈥?Up to 50 MHz CPU operating frequency when
executing from Flash
鈥?Realtime Clock for clock-calendar function
鈥?4 power saving modes: SLOW, WAIT, STOP
and STANDBY modes
Nested interrupt controller
鈥?Fast interrupt handling with multiple vectors
鈥?32 vectors with 16 IRQ priority levels
鈥?2 maskable FIQ sources
Up to 48 I/O ports
鈥?30/32/48 multifunctional bidirectional I/O lines
鈥?14 ports with interrupt capability
5 Timers
鈥?16-bit watchdog timer
鈥?4 16-bit timers with: 2 input captures, 2 output
compares, PWM and pulse counter modes
TQFP64
10 x 10
TQFP144
20 x 20
LFBGA64 8 x 8 x 1.7
LFBGA64
8 x 8 x 1.7
鈻?/div>
LFBGA144 10 x 10 x 1.7
鈻?/div>
鈻?/div>
10 Communications Interfaces
鈥?2 I
2
C interfaces (1 multiplexed with SPI)
鈥?4 UART asynchronous serial interfaces
鈥?Smart Card ISO7816-3 interface on UART1
鈥?2 BSPI synchronous serial interfaces
鈥?CAN interface (2.0B Active)
鈥?USB v 2.0 Full Speed (12Mbit/s) Device Func-
tion with Suspend and Resume support
鈥?HDLC synchronous communications
4-channel 12-bit A/D Converter
鈥?Conversion time:
鈥?4 channels: up to 500 Hz (2 ms)
鈥?1 channel: up to 1 kHz (1 ms)
鈥?Conversion range: 0 to 2.5V
Development Tools Support
鈥?JTAG with debug mode trigger request
Table 1.
Device Summary
Features
FLASH - Kbytes
RAM - Kbytes
Peripheral Functions
Operating Voltage
Operating Temp.
Packages
T=TQFP144
20 x 20
H=LFBGA144
10 x10
STR710FZ
1
2
128+16
256+16
32
64
CAN, EMI, USB,
48 I/Os
STR711FR
STR712FR
0
1
2
0
1
2
64+16 128+16 256+16 64+16 128+16 256+16
16
32
USB, 30 I/Os
64
16
32
CAN, 32 I/Os
64
STR715FR
0
64+16
16
32 I/Os
3.0 to 3.6V (optional 1.8V for core)
-40 to +85掳C
T=TQFP64
10 x10 /
H=LFBGA64
8 x 8 x 1.7
Rev. 6
April 2005
1/49
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
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