Philips Semiconductors
Objective speci铿乧ation
UHF power LDMOS transistor
PACKAGE OUTLINE
Flanged ceramic package; 2 mounting holes; 2 leads
BLF2022-125
SOT634A
Package under
development
D
Philips Semiconductors reserves the
right to make changes without notice.
A
F
3
D1
U1
q
C
B
c
L
1
U2
p
w1
M
A
M
B
M
E1
E
A
L
2
Q
b
w2
M
C
M
0
5
scale
10 mm
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
mm
inches
A
4.83
3.68
0.190
0.145
b
12.82
12.57
0.505
0.495
c
0.15
0.08
0.006
0.003
D
22.58
22.12
0.889
0.871
D1
22.56
22.15
0.888
0.872
E
E1
F
1.14
0.89
0.045
0.035
L
5.33
4.32
0.210
0.170
p
3.38
3.12
0.133
0.123
Q
1.70
1.45
0.067
0.057
q
27.94
1.100
U1
34.16
33.91
1.345
1.335
U2
13.84
13.59
0.545
0.535
w1
0.25
0.010
w2
0.51
0.020
13.34 13.34
13.08 13.08
0.525 0.525
0.515 0.515
OUTLINE
VERSION
SOT634A
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
01-11-27
2003 Mar 07
5