Product Datasheet
TGA1073C-SCC
1
碌
F Cap on
Supply Line
V
G
0.01
碌
F
100pF
100pF
RF In
RF Out
100pF
100pF
1
碌
F Cap on
Supply Line
0.01
碌
F
V
D
Chip Assembly and Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor Texas : (972)994 8465
Fax (972)994 8504 Web: www.triquint.com
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