AT24C01A/02/04/08A/16A
AT24C01A Ordering Information
(1)
Ordering Code
AT24C01A-10PI-2.7
AT24C01A-10SI-2.7
AT24C01A-10TI-2.7
AT24C01A-10PI-1.8
AT24C01A-10SI-1.8
AT24C01A-10TI-1.8
AT24C01A-10PU-2.7
(2)
AT24C01A-10PU-1.8
(2)
AT24C01A-10SU-2.7
(2)
AT24C01A-10SU-1.8
(2)
AT24C01A-10TU-2.7
(2)
AT24C01A-10TU-1.8
(2)
AT24C01A-10TSU-1.8
(2)
AT24C01AU3-10UU-1.8
(2)
AT24C01AY1-10YU-1.8
(2)
AT24C01A-W2.7-11
(3)
AT24C01A-W1.8-11
(3)
Notes:
Package
8P3
8S1
8A2
8P3
8S1
8A2
8P3
8P3
8S1
8S1
8A2
8A2
5TS1
8U31
8Y1
Die Sale
Die Sale
Operation Range
Industrial Temperature
(鈥?0掳C to 85掳C)
Industrial Temperature
(鈥?0掳C to 85掳C)
Lead-free/Halogen-free/
Industrial Temperature
(鈥?0掳C to 85掳C)
Industrial Temperature
(鈥?0掳C to 85掳C)
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. 鈥淯鈥?designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
Package Type
8P3
8S1
8A2
8Y1
5TS1
8U3-1
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Away Package (dBGA2)
Options
鈥?.7
鈥?.8
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 5.5V)
13
0180V鈥揝EEPR鈥?/05