鈥?/div>
1.45
1.30
0.15
3.20
1.80
3.10
0.60
0.80
30掳
0.26
0.51
MAX
Number of Pins
Pitch
Outside Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
e
e1
A
A2
A1
E
E1
D
L
L1
蠁
c
b
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-028B
漏
2007 Microchip Technology Inc.
DS21929D-page 29