LIS3L02AL
Package Information
6
Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK
庐
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 20. LGA-8 Mechanical Data & Package Dimensions
DIM.
A1
A2
A3
D1
E1
L
L1
M
M1
N
N1
N2
P1
P2
T1
T2
R
h
k
j
0.615
1.200
0.150
0.050
0.100
1.300
0.740
0.875
0.180
4.850
4.850
0.220
5.000
5.000
1.270
2.540
1.225
0.900
2.000
1.225
1.170
1.350
0.790
1.170
0.640
mm
MIN.
1.460
TYP.
1.520
MAX.
MIN.
inch
TYP.
MAX.
1.600 0.0574 0.0598 0.0629
1.330
0.260
5.150
5.150
0.0523
0.007 0.0086 0.0102
0.190 0.1968 0.2027
0.190 0.1968 0.2027
0.05
0.1
0.0482
0.925 0.0344 0.0354 0.0364
0.0787
0.0482
0.046
1.400 0.0511 0.0531 0.0551
0.840 0.0291 0.0311 0.033
0.046
0.665 0.0242 0.0251 0.0261
1.600 0.0472
0.0059
0.0019
0.0039
0.0629
OUTLINE AND
MECHANICAL DATA
LGA8 (5x5x1.6mm)
Land Grid Array Package
E1
A
A3
K
C
T1
E
M
M1
K
(4x)
8
D
D1
R
L
T2
= =
N
7
L1
6
5
4
K D
1
2
3
N2
N1
A2
A1
P1
h
CA B
seating plane
DETAIL A
K
Detail A
h
C A B
P2
D
K E
B
E
SOLDER MASK
OPENING
C A B
METAL PAD
j
j
C A B
7669231 C
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