+125藲C. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent
the most likely parametric norm at T
J
= 25藲C, and are provided for reference purposes only. (Continued)
Symbol
胃
JA
胃
JC
T
SD
Parameter
Junction to Ambient
0 LFPM Air Flow (Note 3)
Junction to Case (Note 3)
Thermal Shutdown Temperature
Conditions
LLP-6 Package
SOT23-5 Package
LLP-6 Package
SOT23-5 Package
Min
Typ
80
118
18
80
165
Max
Units
藲C/W
藲C/W
藲C
Note 1:
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Range indicates conditions for which the device is
intended to be functional, but does not guarantee specfic performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2:
Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.
Note 3:
Applies for packages soldered directly onto a 3鈥?x 3鈥?PC board with 2oz. copper on 4 layers in still air.
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