MCP73864-I/ML Datasheet

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MCP73861/2/3/4

16-Lead Plastic Small Outline (SL) 鈥?Narrow 150 mil Body (SOIC)

E

E1

p

D

2

B

n

1

伪

h

45掳

c

A

A2

蠁

L

尾

Units

Dimension Limits

n

p

INCHES*

MIN

NOM

16

.050

.053

.061

.052

.057

.004

.007

.228

.237

.150

.154

.386

.390

.010

.015

.016

.033

0

4

.008

.009

.013

.017

0

12

0

12

MILLIMETERS

MIN

NOM

16

1.27

1.35

1.55

1.32

1.44

0.10

0.18

5.79

6.02

3.81

3.90

9.80

9.91

0.25

0.38

0.41

0.84

0

4

0.20

0.23

0.33

0.42

0

12

0

12

A1

MAX

MAX

Number of Pins

Pitch

Overall Height

A

.069

1.75

Molded Package Thickness

A2

.061

1.55

Standoff

搂

A1

.010

0.25

Overall Width

E

.244

6.20

Molded Package Width

E1

.157

3.99

Overall Length

D

.394

10.01

Chamfer Distance

h

.020

0.51

Foot Length

L

.050

1.27

蠁

Foot Angle

8

8

c

Lead Thickness

.010

0.25

Lead Width

B

.020

0.51

伪

Mold Draft Angle Top

15

15

尾

Mold Draft Angle Bottom

15

15

*

Controlling Parameter

搂

Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010鈥?(0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-108

DS21893C-page 22

漏

2005 Microchip Technology Inc.

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