MCP6541/1R/1U/2/3/4
5-Lead Plastic Small Outline Transistor (LT) (SC-70)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
D
p
B
n
1
Q1
c
A2
A
L
Units
Dimension Limits
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Top of Molded Pkg to
Lead Shoulder
Lead Thickness
Lead Width
*
Controlling Parameter
Notes:
n
p
A
A2
A1
E
E1
D
L
Q1
c
B
MIN
INCHES
NOM
5
.026 (BSC)
.031
.031
.000
.071
.045
.071
.004
.004
.004
.006
A1
MILLIMETERS*
MAX
MIN
NOM
5
0.65 (BSC)
.043
.039
.004
.094
.053
.087
.012
.016
.007
.012
0.80
0.80
0.00
1.80
1.15
1.80
0.10
0.10
0.10
0.15
1.10
1.00
0.10
2.40
1.35
2.20
0.30
0.40
0.18
0.30
MAX
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEITA (EIAJ) Standard: SC-70
Drawing No. C04-061
Revised 07-19-05
漏
2006 Microchip Technology Inc.
DS21696E-page 21