MCP6541/1R/1U/2/3/4
8-Lead Plastic Dual In-line (P) 鈥?300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
D
2
n
1
伪
E
A
A2
c
L
A1
尾
eB
B1
p
B
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
4.32
Molded Package Thickness
A2
.115
.145
3.68
Base to Seating Plane
.015
A1
Shoulder to Shoulder Width
E
.300
.313
.325
8.26
Molded Package Width
E1
.240
.250
.260
6.60
Overall Length
D
.360
.373
.385
9.78
Tip to Seating Plane
L
.125
.130
.135
3.43
c
Lead Thickness
.008
.012
.015
0.38
Upper Lead Width
B1
.045
.058
.070
1.78
Lower Lead Width
B
.014
.018
.022
0.56
eB
Overall Row Spacing
搂
.310
.370
.430
10.92
伪
Mold Draft Angle Top
5
10
15
15
尾
Mold Draft Angle Bottom
5
10
15
15
*
Controlling Parameter
搂
Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010鈥?(0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
8
.100
.155
.130
MAX
MIN
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MAX
漏
2006 Microchip Technology Inc.
DS21696E-page 23