MCP6541/1R/1U/2/3/4
14-Lead Plastic Dual In-line (P) 鈥?300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
D
2
n
1
伪
E
A
A2
c
尾
eB
A1
B1
B
p
L
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
4.32
Molded Package Thickness
A2
.115
.145
3.68
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
8.26
Molded Package Width
.240
.250
.260
6.60
E1
Overall Length
D
.740
.750
.760
19.30
Tip to Seating Plane
L
.125
.130
.135
3.43
c
Lead Thickness
.008
.012
.015
0.38
Upper Lead Width
B1
.045
.058
.070
1.78
Lower Lead Width
B
.014
.018
.022
0.56
eB
Overall Row Spacing
搂
.310
.370
.430
10.92
伪
Mold Draft Angle Top
5
10
15
15
尾
Mold Draft Angle Bottom
5
10
15
15
*
Controlling Parameter
搂
Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010鈥?(0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
14
.100
.155
.130
MAX
MIN
MILLIMETERS
NOM
14
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
18.80
19.05
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MAX
DS21696E-page 26
漏
2006 Microchip Technology Inc.