MCP6541RT-E/OT Datasheet

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MCP6541/1R/1U/2/3/4

14-Lead Plastic Small Outline (SL) 鈥?Narrow, 150 mil (SOIC)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

E

E1

p

D

2

B

n

1

伪

h

45掳

c

A

A2

蠁

尾

L

A1

Number of Pins

Pitch

Overall Height

A

.053

.069

1.75

Molded Package Thickness

A2

.052

.061

1.55

Standoff

搂

A1

.004

.010

0.25

Overall Width

E

.228

.244

6.20

Molded Package Width

.150

.157

3.99

E1

Overall Length

D

.337

.347

8.81

Chamfer Distance

h

.010

.020

0.51

Foot Length

L

.016

.050

1.27

蠁

Foot Angle

0

8

8

c

Lead Thickness

.008

.010

0.25

Lead Width

B

.014

.020

0.51

伪

Mold Draft Angle Top

0

15

15

尾

Mold Draft Angle Bottom

0

15

15

*

Controlling Parameter

搂

Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010鈥?(0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-065

Revised 7-20-06

Units

Dimension Limits

n

p

MIN

INCHES*

NOM

14

.050

.061

.056

.007

.236

.154

.342

.015

.033

4

.009

.017

12

12

MAX

MIN

MILLIMETERS

NOM

14

1.27

1.35

1.55

1.32

1.42

0.10

0.18

5.79

5.99

3.81

3.90

8.56

8.69

0.25

0.38

0.41

0.84

0

4

0.20

0.23

0.36

0.42

0

12

0

12

MAX

漏

2006 Microchip Technology Inc.

DS21696E-page 27

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