MCP6541/1R/1U/2/3/4
14-Lead Plastic Thin Shrink Small Outline (ST) 鈥?4.4 mm (TSSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
D
2
n
B
1
A
c
蠁
伪
尾
L
Units
Dimension Limits
MIN
n
p
A
A2
A1
E
E1
D
L
蠁
c
B
伪
尾
.039
.033
.002
.246
.169
.193
.020
0掳
.004
.007
INCHES
NOM
14
.026 BSC
.041
.035
.004
.251
.173
.197
.024
4掳
.006
.010
12掳 REF
12掳 REF
A1
MILLIMETERS*
MAX
MIN
NOM
14
0.65 BSC
.043
.037
.006
.256
.177
.201
.028
8掳
.008
.012
1.00
0.85
0.05
6.25
4.30
4.90
0.50
0掳
0.09
0.19
1.05
0.90
0.10
6.38
4.40
5.00
0.60
4掳
0.15
0.25
12掳 REF
12掳 REF
A2
MAX
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1.10
0.95
0.15
6.50
4.50
5.10
0.70
8掳
0.20
0.30
*
Controlling Parameter
Notes:
Dimensions D and E1 do not include mold fla sh or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tole rance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MO-153 AB-1
Drawing No. C04-087
Revised: 08-17-05
DS21696E-page 28
漏
2006 Microchip Technology Inc.