1G A-die DDR2 SDRAM
Absolute Maximum DC Ratings
Symbol
V
DD
V
DDQ
V
DDL
V
IN,
V
OUT
T
STG
Parameter
Voltage on V
DD
pin relative to V
SS
Voltage on V
DDQ
pin relative to V
SS
Voltage on V
DDL
pin relative to V
SS
Voltage on any pin relative to V
SS
Storage Temperature
Rating
- 1.0 V ~ 2.3 V
- 0.5 V ~ 2.3 V
- 0.5 V ~ 2.3 V
- 0.5 V ~ 2.3 V
-55 to +100
DDR2 SDRAM
Units
V
V
V
V
掳C
Notes
1
1
1
1
1, 2
Note :
1. Stresses greater than those listed under 鈥淎bsolute Maximum Ratings鈥?may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2
standard.
AC & DC Operating Conditions
Recommended DC Operating Conditions (SSTL - 1.8)
Symbol
V
DD
V
DDL
V
DDQ
V
REF
V
TT
Supply Voltage
Supply Voltage for DLL
Supply Voltage for Output
Input Reference Voltage
Termination Voltage
Parameter
Rating
Min.
1.7
1.7
1.7
0.49*V
DDQ
V
REF
-0.04
Typ.
1.8
1.8
1.8
0.50*V
DDQ
V
REF
Max.
1.9
1.9
1.9
0.51*V
DDQ
V
REF
+0.04
Units
V
V
V
mV
V
4
4
1,2
3
Notes
Note : There is no specific device V
DD
supply voltage requirement for SSTL-1.8 compliance. However under all conditions V
DDQ
must be less than or equal
to V
DD
.
1. The value of V
REF
may be selected by the user to provide optimum noise margin in the system. Typically the value of V
REF
is expected to be about 0.5
x V
DDQ
of the transmitting device and V
REF
is expected to track variations in V
DDQ
.
2. Peak to peak AC noise on V
REF
may not exceed +/-2% V
REF
(DC).
3. V
TT
of transmitting device must track V
REF
of receiving device.
4. AC parameters are measured with V
DD
, V
DDQ
and V
DDL
tied together.
Page 11 of 28
Rev. 1.1 Aug. 2005