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XC7445B Datasheet

  • XC7445B

  • RISC Microprocessor Hardware Specifications

  • 1129.49KB

  • 64页

  • FREESCALE

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Electrical and Thermal Characteristics
Table 5
provides the package thermal characteristics for the MPC7455.
Table 5. Package Thermal Characteristics
6
Value
Characteristic
Symbol
MPC7445
Junction-to-ambient thermal resistance, natural
convection
Junction-to-ambient thermal resistance, natural
convection, four-layer (2s2p) board
Junction-to-ambient thermal resistance, 200 ft/min
airflow, single-layer (1s) board
Junction-to-ambient thermal resistance, 200 ft/min
airflow, four-layer (2s2p) board
Junction-to-board thermal resistance
Junction-to-case thermal resistance
R
胃
JA
R
胃
JMA
R
胃
JMA
R
胃
JMA
R
胃
JB
R
胃
JC
22
14
16
11
6
<0.1
MPC7455
20
14
15
11
6
<0.1
掳C/W
掳C/W
掳C/W
掳C/W
掳C/W
掳C/W
1, 2
1, 3
1, 3
1, 3
4
5
Unit
Notes
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the calculated case temperature. The actual value of R
胃JC
for the part is less
than 0.1掳C/W.
6. Refer to
Section 9.8, 鈥淭hermal Management Information,鈥?/span>
for more details about thermal management.
Table 6
provides the DC electrical characteristics for the MPC7455.
Table 6. DC Electrical Specifications
At recommended operating conditions. See
Table 4.
Characteristic
Nominal
Bus
Voltage
1
1.5
1.8
2.5
Symbol
Min
GV
DD
脳
0.65
OV
DD
/GV
DD
脳
0.65
1.7
鈥?.3
鈥?.3
鈥?.3
1.4
鈥?.3
Max
Unit
Notes
Input high voltage
(all inputs except SYSCLK)
V
IH
V
IH
V
IH
V
IL
V
IL
V
IL
CV
IH
CV
IL
GV
DD
+ 0.3
OV
DD
/GV
DD
+ 0.3
OV
DD
/GV
DD
+ 0.3
GV
DD
脳
0.35
OV
DD
/GV
DD
脳
0.35
0.7
OV
DD
+ 0.3
0.4
V
V
V
V
V
V
V
V
6
Input low voltage
(all inputs except SYSCLK)
1.5
1.8
2.5
6
SYSCLK input high voltage
SYSCLK input low voltage
鈥?/div>
鈥?/div>
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
Freescale Semiconductor
13

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