Pin Assignments
6
Pin Assignments
Figure 18
(in Part A) shows the pinout of the MPC7445, 360 CBGA package as viewed from the top surface. Part B
shows the side profile of the CBGA package to indicate the direction of the top surface view.
Part A
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19
Not to Scale
Part B
Substrate Assembly
Encapsulant
View
Die
Figure 18. Pinout of the MPC7445, 360 CBGA Package as Viewed from the Top Surface
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
Freescale Semiconductor
33