LP62E16128A-T Series
Package Information
48LD CSP (6 x 8 mm) Outline Dimensions
(48TFBGA)
TOP VIEW
BOTTOM VIEW
Ball#A1 CORNER
0.10
S
C
0.25
S
C A B
Ball*A1 CORNER
1 2 3 4 5 6
b (48X)
6 5 4 3 2 1
unit: mm
A
B
C
D
E
F
G
H
e
A
B
C
D
E
F
G
H
B
A
0.10 C
0.20(4X)
E
1
E
e
D
1
D
SIDE VIEW
// 0.25 C
A
2
C
(0.36)
SEATING PLANE
A
1
A
Symbol
A
A
1
A
2
D
E
D
1
E
1
e
b
Dimensions in mm
MIN.
1.00
0.20
0.48
5.90
7.90
---
---
---
0.30
NOM.
1.10
0.25
0.53
6.00
8.00
3.75
5.25
0.75
0.35
MAX.
1.20
0.30
0.58
6.10
8.10
---
---
---
0.40
Note:
1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS
ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).
2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM.
THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF
THE SOLDER BALL AND THE BODY EDGE.
(December, 2003, Version 1.3)
15
AMIC Technology, Corp.