P R E L I M I N A R Y
AC Switching Characteristics over Commercial and Industrial Operating Ranges
Table 51. Power-Up Sequencing (See Figures 32, 33, 34, and 35)
Preliminary
Symbol
t1
t2
t3
t4
t5
t6
t7
Parameter Description
All VCC valid to RESIN and IORESET inactive
RESIN and IORESET inactive to RSTDRV inactive
IORESET active to RSTDRV active
VSYS2, VCC1, and VSYS valid delay from VCC5
VSYS2, VCC1, VSYS, and optionally VMEM valid to
IORESET inactive
VCC5, VSYS2, VCC1, VSYS hold time from IORESET
active
VCC5 hold time from VSYS2, VCC1, and VSYS inactive
Notes
1, 2
2, 3
300
0
0
5
5
0
Min
Typ
1
Max
Unit
s
碌s
ns
ns
碌s
碌s
ns
Notes:
1. This parameter is dependent on the 32-kHz oscillator start-up time. The oscillator start-up time is dependent on the external
component values used, board layout, and power supply noise. See the Crystal Specifications section on page 95 for more
information.
2. RESIN remains inactive during Micro Power Off mode and Micro Power Off mode exit.
3. The pulse width of RSTDRV is adjustable based on PLL startup timing. For more information, see 鈥淟oop Filters鈥?on page 97.
Voltage sequencing on power-up for the 脡lanSC300 microcontroller should be observed as follows:
鈥?VCC
鈥?All VCC clamp sources (VCC, VMEM, VSYS, VCC5, and AVCC)
鈥?All VCCIO sources (VCC5, VMEM, VSYS, VCC1, VSYS2, and AVCC).
The reverse is true when powering down. For any particular I/O pin, the VCCIO may come up simultaneously with the VCC clamp,
but should never precede the VCC clamp. Refer to the Pin Characteristics table (page 24) for detailed I/O information.
脡lan鈩C300 Microcontroller Data Sheet
99