M24C16, M24C08, M24C04, M24C02, M24C01
Figure 15. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm虏, Outline
D
L3
e
b
L1
E
E2
L
A
D2
ddd
A1
UFDFPN-01
Note: 1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
SS
. It must not be allowed to be connected to
any other voltage or signal line on the PCB, for example during the soldering process.
Table 17. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm虏, Data
mm
Symbol
Typ.
A
A1
b
D
D2
ddd
E
E2
e
L
L1
L3
N
8
0.30
8
0.50
0.45
3.00
0.15
鈥?/div>
0.40
0.25
鈥?/div>
0.50
0.15
0.012
0.020
0.018
0.25
2.00
1.55
1.65
0.05
0.118
0.006
鈥?/div>
0.016
0.010
鈥?/div>
0.020
0.006
0.55
Min.
0.50
0.00
0.20
Max.
0.60
0.05
0.30
0.010
0.079
0.061
0.065
0.002
Typ.
0.022
Min.
0.020
0.000
0.008
Max.
0.024
0.002
0.012
inches
20/25
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