74LVT16373 鈥?74LVTH16373 Low Voltage 16-Bit Transparent Latch with 3-STATE Outputs
January 1999
Revised June 2005
74LVT16373 鈥?74LVTH16373
Low Voltage 16-Bit Transparent Latch
with 3-STATE Outputs
General Description
The LVT16373 and LVTH16373 contain sixteen non-invert-
ing latches with 3-STATE outputs and is intended for bus
oriented applications. The device is byte controlled. The
flip-flops appear transparent to the data when the Latch
Enable (LE) is HIGH. When LE is LOW, the data that meets
the setup time is latched. Data appears on the bus when
the Output Enable (OE) is LOW. When OE is HIGH, the
outputs are in a high impedance state.
The LVTH16373 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These latches are designed for low-voltage (3.3V) V
CC
applications, but with the capability to provide a TTL inter-
face to a 5V environment. The LVT16373 and LVTH16373
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
Features
s
Input and output interface capability to systems at
5V V
CC
s
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16373),
also available without bushold feature (74LVT16373)
s
Live insertion/extraction permitted
s
Power Up/Power Down high impedance provides
glitch-free bus loading
s
Outputs source/sink
32 mA/
64 mA
s
Functionally compatible with the 74 series 16373
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human-body model
!
2000V
Machine model
!
200V
Charged-device model
!
1000V
s
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Order Number
74LVT16373GX
(Note 1)
74LVT16373MEA
(Note 2)
74LVT16373MTD
(Note 2)
74LVTH16373GX
(Note 1)
74LVTH16373MEA
(Note 2)
74LVTH16373MTD
(Note 2)
Package Number
BGA54A
(Preliminary)
MS48A
MTD48
BGA54A
(Preliminary)
MS48A
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 1:
BGA package available in Tape and Reel only.
Note 2:
Device also available in Tape and Reel. Specify by appending suffix letter 鈥淴鈥?to the ordering code.
Logic Symbol
漏 2005 Fairchild Semiconductor Corporation
DS012021
www.fairchildsemi.com
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