74LVT240 鈥?74LVTH240 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
July 1999
Revised March 2005
74LVT240 鈥?74LVTH240
Low Voltage Octal Buffer/Line Driver
with 3-STATE Outputs
General Description
The LVT240 and LVTH240 are inverting octal buffers and
line drivers designed to be employed as memory address
drivers, clock drivers and bus oriented transmitters or
receivers which provides improved PC board density.
The LVTH240 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
These octal buffers and line drivers are designed for low-
voltage (3.3V) V
CC
applications, but with the capability to
provide a TTL interface to a 5V environment. The LVT240
and LVTH240 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
Features
s
Input and output interface capability to systems at
5V V
CC
s
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH240),
also available without bushold feature (74LVT240)
s
Live insertion/extraction permitted
s
Power Up/Down high impedance provides glitch-free
bus loading
s
Outputs source/sink
32 mA/
64 mA
s
Functionally compatible with the 74 series 240
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human-body model
!
2000V
Machine model
!
200V
Charged-device model
!
1000V
Ordering Code:
Order Number
74LVT240WM
74LVT240SJ
74LVT240MSA
74LVT240MTC
74LVT240MTCX_NL
(Note 1)
74LVTH240WM
74LVTH240SJ
74LVTH240MSA
74LVTH240MTC
74LVTH240MTCX_NL
(Note 1)
Package
Number
M20B
M20D
MSA20
MTC20
MTC20
M20B
M20D
MSA20
MTC20
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter 鈥淴鈥?to the ordering code.
Pb-Free package per JECED J-STD-020B.
Note 1:
鈥淿NL鈥?indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
漏 2005 Fairchild Semiconductor Corporation
DS500153
www.fairchildsemi.com
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