鈾?/div>
High temperature soldering guaranteed:
350掳C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
P
A
T
E
N
T
1.0 (25.4)
MIN
0.250 (6.3)
0.170 (4.3)
DIA.
0.300 (7.6)
MAX.
0.052 (1.32)
0.048 (1.22)
DIA.
1.0 (25.4)
MIN
MECHANICAL DATA
Case:
Solid glass body
Terminals:
Solder plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.04 ounce, 1.1 grams
Dimensions in inches and (millimeters)
*
Brazed-lead assembly is covered by Patent No. 3,930,306
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25掳C ambient temperature unless otherwise specified.
SYMBOLS
BY228
UNITS
Maximum non repetitive peak reverse voltage
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375鈥?(9.5mm) lead length at T
A
= 50掳C
Peak forward surge current 10ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage at 2.5A
Working peak forward current at T
A
=75掳C
Peak repetitive forward surge current at T
A
=75掳C
Maximum peak reverse current
at rated peak reverse voltage
Maximum reverse recovery time
(NOTE 1)
Maximum forward recovery time
Typical junction capacitance
Typical thermal resistance
(NOTE 2)
V
RSM
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
FWM
I
FRM
I
R
t
rr
t
fr
C
J
R
螛JA
T
J
T
STG
T
A
=25掳C
T
J
=140掳C
1650
1500
1050
1500
2.5
50.0
1.6
5.0
10.0
5.0
200
20.0
1.0
40.0
20.0
-65 to +150
-65 to +200
Volts
Volts
Volts
Volts
Amps
Amps
Volts
Amps
Amps
碌A
碌s
碌s
pF
掳C/W
掳C
掳C
(NOTE 2)
(NOTE 4)
Operating junction temperature range
Storage temperature range
NOTES:
(1) Measured with I
F
=1.0A, I
R
=50mA, di/dt=50mA/碌s
(2) Measured with I
F
=5.0A with tr=0.1碌s
(3) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(4) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length,
P.C.B. mounted
4/98
1
2
