MCC
Features
l
l
l
l
omponents
21201 Itasca Street Chatsworth
!"#
$% !"#
BZT52C2V4S
THRU
BZT52C39S
200 mW
Zener Diodes
2.4 to 39 Volts
Planar Die construction
200mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ideally Suited for Automated Assembly Processes
Mechanical Data
l
l
l
l
l
Case:
SOD-323 Molded Plastic
SOD323
A
B
C
o
o
Terminals: Solderable per MIL-STD-202, Method 208
Approx. Weight: 0.008 gram
Mounting Position: Any
Storage & Operating Junction Temperature: -55 C to +150 C
E
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Zener Current
I
F
100
mA
Maximum Forward
V
F
1.2
V
Voltage
Power Dissipation
P
(AV)
200
mWatt
(No te s A)
Peak Forward S urge
I
FSM
2.0
Amps
Current (Not e s B)
NOTES:
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or equivalent
square wave, duty cycle = 4 pulses per minute maximum
.
DIM
A
B
C
D
E
F
G
F
D
G
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.090
.107
2.30
2.70
.068
.078
1.75
1.95
.045
.054
1.15
1.35
.027
.038
0.70
0.95
.009
.014
0.25
0.35
.002
.006
0.05
0.15
.012
---
0.30
---
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.059"
0.039鈥?/div>
0.031鈥?/div>
www.mccsemi.com
1
2
3
4
