鈥?/div>
10掳
0.254
10掳
Max
6.71
3.10
7.29
3.71
2.35
1.00
1.30
1.80
0.102
0.79
4.70
10掳
16掳
0.356
16掳
A
B
C
D
E
D
C D
G
E
J
K
D
S
G
H
G
P
R
S
H
J
K
L
M
N
P
R
S
L
M
N
Mechanical Data
路
路
SOT-223 Plastic Case
Terminal Connections: See Outline Drawing
and Internal Circuit Diagram Above
25掳C unless otherwise specified
Symbol
V
DSS
V
GSS
Note 1a Continuous
Pulsed
Note 1 a
Note 1 b
Note 1 c
I
D
P
d
T
j
, T
STG
Value
-30
卤20
卤5.9
卤15
3.0
1.3
1.1
-65 to +150
All Dimensions in mm
Maximum Ratings
Drain-Source Voltage
Gate-Source Voltage
Drain Current
Maximum Power Dissipation
Characteristic
Unit
V
V
A
W
掳C
Operating and Storage Temperature Range
Thermal Characteristics
Characteristic
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
Note 1
Symbol
R
QJA
R
QJC
Value
42
12
Unit
掳C/W
掳C/W
Notes:
1. R
QJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as
the solder mounting surface of the drain pins. R
QJC
is guaranteed by design while R
QCA
is determined by the user鈥檚 board design.
1a. With 1 in
2
oz 2 oz. copper mounting pad R
QJA
= 42掳C/W.
1b. With 0.0066 in
2
oz 2 oz. copper mounting pad R
QJA
= 95掳C/W.
1c. With 0.0123 in
2
oz 2 oz. copper mounting pad R
QJA
= 110掳C/W.
DS11613 Rev. C-4
1 of 4
DT454P
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2
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