FSUSB23L10X Datasheet

  • FSUSB23L10X

  • Low Power Hi-Speed USB 2.0 (480Mbps) Switch

  • 335.18KB

  • 12页

  • FAIRCHILD

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FSUSB23 Low Power Hi-Speed USB 2.0 (480Mbps) Switch
August 2005
Revised August 2005
FSUSB23
Low Power Hi-Speed USB 2.0 (480Mbps) Switch
General Description
The FSUSB23 is a low power high bandwidth analog switch
specifically designed for high speed USB 2.0 applications. The
FSUSB23 features very low quiescent current even when the
control voltage is lower than the V
CC
supply. This feature ser-
vices mobile handset applications well allowing for direct inter-
face with the baseband processor general purpose I/Os. Typical
applications involve switching in portables and consumer appli-
cations such as cell phones, digital cameras, and notebooks
with hubs or controllers. The wide bandwidth (>720MHz) of this
switch exceeds the bandwidth needed to pass the 3
rd
harmonic
which results in signals with minimum edge and phase distor-
tion. Superior channel-to-channel crosstalk results in minimal
interference.
Features
O
10
P
A maximum I
CCT
current over an expanded control
voltage range (V
IN
= 2.6V, V
CC
= 3.6V)
O
Lower Capacitance: Con = 9pF Typ
O
7
:
typical On Resistance (R
ON
)
O

3dB bandwidth: > 720MHz
O
Low power consumption (1
P
A maximum)
O
Packaged in:
Pb-Free 10-lead MicroPak
(1.6mm by 2.1mm)
Pb-Free 16-lead DQFN
O
7kV I/O to GND ESD performance
Applications
O
Cell phone, PDA, Digital Camera, and Notebook
O
LCD Monitor, TV, and Set-top Box
Ordering Code:
Order
Number
FSUSB23L10X
FSUSB23BQX
Package
Number
MAC010A
MLP016E
Package Description
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm
Pb-Free 16-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241,
2.5 x 3.5mm
Pb-Free package per JEDEC J-STD-020B.
MicroPak
is a trademark of Fairchild Semiconductor Corporation.
漏 2005 Fairchild Semiconductor Corporation
DS500925
www.fairchildsemi.com

FSUSB23L10X 产品属性

  • 5,000

  • 集成电路 (IC)

  • 接口 - 模拟开关,多路复用器,多路分解器

  • -

  • USB 开关

  • 1 x 2:2

  • 10 欧姆

  • 单电源

  • 3 V ~ 3.6 V

  • -

  • -40°C ~ 85°C

  • 表面贴装

  • 10-UFQFN

  • 10-MicroPak?

  • 带卷 (TR)

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