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typ
RSS170TS-ESE
RSS170TS-DPG
OLS170TS-DPG
OIS170TS-DPG
AJS170TS-DPG
ALS170TS-DPG
YVS170TS-DPE
YHS170TS-EPE
GBS170TS-DPG
GUS170TS-EPE
GPS170TS-EPE
GES170TS-IPG
GGS170TS-IPG
BJS170TS-JPH
BVS170TS-EPC
Red
Red
Orange
Orange
Amber
Amber
Yellow
Yellow
Green
Green
Green
Green
Green
Blue
Blue
GaAlAs
AlGaInP
AlGaInP
AlGaInP
AlGaInP
AlGaInP
AlGaInP
GaAsP
AlGaInP
GaP
GaP
InGaN
InGaN
InGaN
GaN/SiC
1.80
1.90
1.90
1.90
1.90
1.90
2.00
2.10
2.10
2.25
2.20
3.20
3.30
3.40
4.00
2.30
2.40
2.40
2.40
2.40
2.40
2.50
2.50
2.60
2.70
2.70
3.80
4.00
4.00
4.50
643
631
624
615
605
595
593
587
578
572
573
527
509
465
465
660
640
634
620
610
598
594
586
575
567
567
525
505
460
430
25
23
25
18
25
20
32
37
18
32
30
40
37
68
60
19
52
67
75
52
75
57
7
37
17
15
120
120
36
8
Internal
Circuit
!
Package
Outline Drawing:
!
Recommended Soldering Pattern For Reflow
Soldering
!
Recommended Reflow Soldering Profile.
NOTES:
1. All dimensions are in millimeters (inches);
2. Tolerance are
卤0.1mm
(0.004inch) unless otherwise noted;
3. Resin color: water clear.
!
Soldering iron
Basic spec is
!
5sec when 260. If temperature is higher, time should
be shorter(+10" -1sec ).Power dissipation of iron should be smaller than
15W,and temperatures should be controllable .Surface temperature of the
device should be under 230.
!
Absolute
Maximum Ratings:
Series
GH-S170 Series
I
F
(mA)
30
!
I
FP
(mA)
120
V
R
(V)
5
T
OP
(
C)
2080
T
ST
(
C)
20100
!
Condition for
I
FP
is pulse of 1/10 duty and 0.1msec width
1
2
3
