鈥?/div>
Current Steering
Freewheeling
Flyback
Oring
FlipKY
TM
Major Ratings and Characteristics
Characteristics
I
F(AV)
Rectangular waveform
V
RRM
I
FSM
@ tp = 5 碌s sine
V
F
T
J
@ 0.5 Apk, T
J
=125掳C
range
IR0530CSP
0.5
30
190
0.33
- 55 to 150
Units
A
V
A
V
掳C
Description
International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with
the lowest V
F
to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and
occupy only 1.08mm
2
of board space. The anode and cathode connections are made through solder bump pads on
one side of the silicon rather than through protruding leads enabling designers to strategically place the diodes on the
PCB. This design not only minimizes board space but also reduces thermal resistance and inductance, which can
improve overall circuit efficiency.
Typical applications include hand-held, portable equipment such as cell phones, MP3 players, PDAs, and portable hard
disk drives where space savings and performance are crucial.
www.irf.com
1
1
2
3
4
5
