0.60鈩?/div>
I
D
3.5A
The leadless chip carrier (LCC) package represents the
logical next step in the continual evolution of surface
mount technology. Desinged to be a close replacement
for the TO-39 package, the LCC will give designers the
extra flexibility they need to increase circuit board den-
sity. International Rectifier has engineered the LCC pack-
age to meet the specific needs of the power market by
increasing the size of the bottom source pad, thereby
enhancing the thermal and electrical performance. The
lid of the package is grounded to the source to reduce
RF interference.
LCC-18
Features:
!
!
!
!
!
!
!
!
Surface Mount
Small Footprint
Alternative to TO-39 Package
Hermetically Sealed
Dynamic dv/dt Rating
Avalanche Energy Rating
Simple Drive Requirements
Light Weight
Absolute Maximum Ratings
Parameter
ID @ VGS = 10V, TC = 25掳C
ID @ VGS = 10V, TC = 100掳C
I DM
PD @ TC = 25掳C
VGS
EAS
IAR
EAR
dv/dt
TJ
T STG
Continuous Drain Current
Continuous Drain Current
Pulsed Drain Current
鉃€
Max. Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
鉃?/div>
Avalanche Current
鉃€
Repetitive Avalanche Energy
鉃€
Peak Diode Recovery dv/dt
鉃?/div>
Operating Junction
Storage Temperature Range
Pckg. Mounting Surface Temp.
Weight
For footnotes refer to the last page
3.5
2.25
14
15
0.09
卤20
7.0
-
-
9.0
-55 to 150
300 (for 5 S)
0.42(typical)
W
W/掳C
Units
A
V
mJ
A
mJ
V/ns
o
C
g
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