鈻?/div>
Compact design to save board space -
1206 footprint
Small size results in very fast time to
react to fault events
Symmetrical design
Low profile
Agency recognition:
USB port protection - On the Go and 2.0
PC motherboards - Plug and Play
protection
Mobile phones - Battery and port
protection
PDAs / Digital Cameras
Game console port protection
MF-NSMF Series -
PTC Resettable Fuses
Electrical Characteristics
Tripped
Power
Dissipation
Ihold
Model
V max.
Volts
I max.
Amps
Itrip
Resistance
Ohms
at 23 掳C
RMin.
R1Max.
Max. Time
To Trip
Amperes
at 23 掳C
Seconds
at 23 掳C
Amperes
at 23 掳C
Hold
Trip
Watts
at 23 掳C
Typ.
MF-NSMF012
MF-NSMF050
MF-NSMF075
MF-NSMF110
MF-NSMF150
30.0
13.2
6.0
6.0
6.0
10
100
100
100
100
0.12
0.50
0.75
1.10
1.50
0.29
1.00
1.50
1.80
3.00
1.50
0.15
0.10
0.06
0.03
6.00
0.70
0.29
0.20
0.13
1.0
8.0
8.0
8.0
8.0
0.20
0.10
0.10
0.10
0.30
0.4
0.4
0.4
0.6
0.6
Environmental Characteristics
Operating Temperature ......................................-40 掳C to +85 掳C
Maximum Device Surface Temperature
in Tripped State ................................................125 掳C
Passive Aging......................................................+85 掳C, 1000 hours ....................................卤5 % typical resistance change
Humidity Aging....................................................+85 掳C, 85 % R.H. 1000 hours ..................卤5 % typical resistance change
Thermal Shock ....................................................+85 掳C to -40 掳C, 20 times ........................卤10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Test Procedures And Requirements For Model MF-MSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 掳C............................................................Rmin
鈮?/div>
R
鈮?/div>
R1max
Time to Trip ....................................At specified current, Vmax, 23 掳C ..................................T
鈮?/div>
max. time to trip (seconds)
Hold Current ..................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage
UL File Number ..................................E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
Thermal Derating Chart - Ihold / Itrip (Amps)
Ambient Operating Temperature
Model
MF-NSMF012
MF-NSMF050
MF-NSMF075
MF-NSMF110
MF-NSMF150
-40 藲C
0.19 / 0.38
0.76 / 1.52
1.11 / 2.22
1.64 / 3.28
2.20 / 4.40
-20 藲C
0.17 / 0.34
0.68 / 1.36
1.00 / 2.00
1.46 / 2.92
1.99 / 3.98
0 藲C
0.15 / 0.30
0.59 / 1.18
0.85 / 1.70
1.30 / 2.60
1.77 / 3.54
23 藲C
0.12 / 0.24
0.50 / 1.00
0.75 / 1.50
1.10 / 2.20
1.50 / 3.00
40 藲C
0.11 / 0.22
0.44 / 0.88
0.67 / 1.34
0.92 / 1.84
1.34 / 2.68
50 藲C
0.10 / 0.20
0.40 / 0.80
0.61 / 1.22
0.83 / 1.66
1.23 / 2.46
60 藲C
0.09 / 0.18
0.35 / 0.70
0.52 / 1.04
0.80 / 1.60
1.10 / 2.20
70 藲C
0.08 / 0.16
0.32 / 0.64
0.50 / 1.00
0.65 / 1.30
1.01 / 2.02
85 藲C
0.07 / 0.14
0.26 / 0.52
0.42 / 0.84
0.52 / 1.04
0.84 / 1.68
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
1
2
3
4
