surface mount plastic package.
鈩?/div>
systems by combining low noise
figure with high IP
3
. Typical
applications include narrow and
broadband linear amplifiers in
commercial and industrial systems.
05 Plastic Package
The MSA-series is fabricated using
HP鈥檚 10 GHz f
T
, 25 GHz f
MAX
silicon bipolar MMIC process
which uses nitride self-alignment,
ion implantation, and gold metalli-
zation to achieve excellent
performance, uniformity and
reliability. The use of an external
bias resistor for temperature and
current stability also allows bias
flexibility.
Typical Biasing Configuration
R
bias
V
CC
>
8
V
RFC (Optional)
4
C
block
3
IN
1
MSA
C
block
OUT
V
d
= 5.5 V
2
5965-9557E
6-458