NCP2809 Datasheet

  • NCP2809

  • cost-effective stereo audio power amplifier 

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NCP2809 Series
NOCAPt 135 mW Stereo
Headphone Power Amplifier
The NCP2809 is a cost鈭抏ffective stereo audio power amplifier
capable of delivering 135 mW of continuous average power per
channel into 16
W
loads.
The NCP2809 audio power amplifier is specifically designed to
provide high quality output power from low supply voltage,
requiring very few external components. Since NCP2809 does not
require bootstrap capacitors or snubber networks, it is optimally
suited for low鈭抪ower portable systems. NCP2809A has an internal
gain of 0 dB while specific external gain can externally be set with
NCP2809B.
If the application allows it, the virtual ground provided by the
device can be connected to the middle point of the headset (Figure 1).
In such case, the two external heavy coupling capacitors typically
used can be removed. Otherwise, you can also use both outputs in
single ended mode with external coupling capacitors (Figure 43).
Due to its excellent Power Supply Rejection Ratio (PSRR), it can
be directly connected to the battery, saving the use of an LDO.
Features
http://onsemi.com
MARKING
DIAGRAM
10
1
Micro10
DM SUFFIX
CASE 846B
MAx
AYW
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
X = E for NCP2809A
X =
C for NCP2809B
A = Assembly Location
Y = Year
W = Work Week
Pb鈭扚ree Package is Available
135 mW to a 16
W
Load from a 5.0 V Power Supply
Excellent PSRR (85 dB Typical): Direct Connection to the Battery
鈥淧op and Click鈥?Noise Protection Circuit
Ultra Low Current Shutdown Mode
2.2 V鈥?.5 V Operation
Outstanding Total Harmonics Distortion + Noise (THD+N): Less
than 0.01%
鈥?/div>
External Turn鈭抩n and Turn鈭抩ff Configuration Capability
鈥?/div>
Thermal Overload Protection Circuitry
Typical Applications
PIN CONNECTIONS
IN_R
SD
BYP
REF_I
IN_L
1
2
3
4
5
10
9
8
7
6
OUT_R
V
M
OUT_I
V
P
OUT_L
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Cellular Phone
Portable Stereo
MP3 Player
Personal and Notebook Computers
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 20 of this data sheet.
Semiconductor Components Industries, LLC, 2004
1
November, 2004 鈭?Rev. 7
Publication Order Number:
NCP2809/D

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