SURFACE MOUNT
NETWORKS
OSOP
Vishay Thin Film
SURFACE MOUNT
Molded, 25 Mil Pitch, Dual-In-Line Resistor Network
FEATURES
鈥?0.068" (1.73mm) maximum seated height
鈥?Rugged molded case construction with no internal solder
鈥?Highly stable thin film
Actual Size
鈥?JEDEC MO #137 Package AD
OSOP Series resistor networks feature a space saving 25
Mil lead pitch versus the current 50 Mil pitch standard. This
allows users to reduce board space more than 50% over
current standards. The OSOP Series feature 10 isolated
resistors in a 20 lead style available for immediate delivery
in the standard values listed.
TYPICAL PERFORMANCE
q
TCR
TOL
ABS
25
ABS
0.1
TRACKING
5
RATIO
0.05
SCHEMATIC
20
19
18
17
16
15
14
13
12
11
STANDARD RESISTANCE OFFERING
(R
1
= )
500 ohms
1K ohms
2K ohms
10K ohms
20K ohms
50K ohms
100K ohms
1
2
3
4
5
6
7
8
9
10
5K ohms
Consult factory for additional values.
STANDARD ELECTRICAL SPECIFICATIONS
TEST
MATERIAL
TCR:
Tolerance:
Power Rating:
Stability
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
Thermal EMF
Shelf Life Stability: Absolute
Ratio
Tracking
Absolute
Ratio
Absolute
Resistor
Package
SPECIFICATIONS
TAMELOX庐
卤
5ppm/掳C
卤
25ppm/掳C
卤
0.5%,
卤
0.1%,
卤
0.05%
卤
1%,
卤
0.5%,
卤
0.25%,
卤
0.1%
100mW
400mW
500ppm
150ppm
< 0.1ppm/Volt typical
100 Volts Max.
- 55掳C to + 125掳C
- 55掳C to + 150掳C
< - 30dB
0.08碌V/掳C
100ppm
20ppm
1 year @ + 25掳C
1 year @ + 25掳C
- 55掳C to + 125掳C
- 55掳C to + 125掳C
+ 25掳C
+ 25掳C
Max. @ + 70掳C
Max. @ + 70掳C
2000 hrs @ + 70掳C
2000 hrs @ + 70掳C
CONDITIONS
鈭?/div>
R Absolute
鈭?/div>
R Ratio
VISHAY THIN FILM 鈥?FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 鈥?GERMANY +49.9287.710 FAX: +49 9287.70435 鈥?ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
鈥?ITALY + 39.2.300.11919 FAX: +39.2.300.11999 鈥?JAPAN +81.42.729.0661 FAX: +81.42.729.3400 鈥?SINGAPORE +65.788.6668 FAX: +65.788.0988
鈥?SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 鈥?UK +44 191 514 8237 FAX: +44 1953 457 722 鈥?USA: (610) 407-4800 FAX: (610) 640-9081
www.vishay.com
16
Document Number: 60002
Revision 03-May-01
next