S1A/B - S1M/B
1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Features
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Glass Passivated Die Construction
Low Forward Voltage Drop and High Current
Capability
Surge Overload Rating to 30A Peak
Ideally Suited for Automated Assembly
A
SMA
Dim
A
B
C
D
E
G
H
Min
2.29
4.00
1.27
0.15
4.80
0.10
0.76
2.01
Max
2.92
4.60
1.63
0.31
5.59
0.20
1.52
2.62
SMB
Min
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
B
Mechanical Data
Case: Molded Plastic
Case Material - UL Flammability Rating
Classification 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Terminals: Solder Plated Terminal -
Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
SMA Weight: 0.064 grams (approx.)
SMB Weight: 0.093 grams (approx.)
Marking: Type Number, See Page 2
Ordering Information: See Page 2
C
D
J
H
G
E
J
All Dimensions in mm
A, B, D, G, J, K, M Suffix Designates SMA Package
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
T
A
= 25掳C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@ T
T
= 100掳C
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on rated load
(JEDEC Method)
Forward Voltage
Peak Reverse Leakage Current
at Rated DC Blocking Voltage
Typical Total Capacitance
Operating and Storage Temperature Range
@ I
F
= 1.0A
@ T
A
= 25掳C
@ T
A
= 125掳C
(Note 1)
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
RM
C
T
R
qJT
T
j,
T
STG
S1
A/AB
50
35
S1
B/BB
100
70
S1
D/DB
200
140
S1
G/GB
400
280
1.0
30
1.1
5.0
100
10
30
-65 to +150
S1
J/JB
600
420
S1
K/KB
800
560
S1
M/MB
1000
700
Unit
V
V
A
A
V
mA
pF
掳C/W
掳C
Typical Thermal Resistance, Junction to Terminal (Note 2)
Notes:
1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2. Thermal Resistance Junction to Terminal, unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pads as heat sink.
DS16003 Rev. 8 - 2
1 of 2
S1A/B - S1M/B
1
2
