SN74AUC2G07DCKRE4 Datasheet

  • SN74AUC2G07DCKRE4

  • DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

  • 297.46KB

  • 11页

  • TI

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SN74AUC2G07
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES443A 鈥?MAY 2003 鈥?REVISED MARCH 2005
FEATURES
鈥?/div>
鈥?/div>
Available in the Texas Instruments
NanoStar鈩?and NanoFree鈩?Packages
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
I
off
Supports Partial-Power-Down Mode
Operation
Sub-1-V Operable
Max t
pd
of 2.5 ns at 1.8 V
Low Power Consumption, 10
碌A
at 1.8 V
卤8-mA
Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
鈥?2000-V Human-Body Model (A114-A)
鈥?200-V Machine Model (A115-A)
鈥?1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
1A
GND
2A
1
2
3
6
5
4
1Y
V
CC
2Y
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
YEP OR YZP PACKAGE
(BOTTOM VIEW)
2A
GND
1A
3 4
2 5
1 6
2Y
V
CC
1Y
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is operational at 0.8-V to 2.7-V V
CC
, but is designed specifically for 1.65-V to 1.95-V V
CC
operation.
The output of the SN74AUC2G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoStar鈩?and NanoFree鈩?package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1)
NanoStar鈩?鈥?WCSP (DSBGA)
0.23-mm Large Bump 鈥?YEP
鈥?0掳C to 85掳C
NanoFree鈩?鈥?WCSP (DSBGA)
0.23-mm Large Bump 鈥?YZP (Pb-free)
SOT (SOT-23) 鈥?DBV
SOT (SC-70) 鈥?DCK
(1)
(2)
Tape and reel
Tape and reel
Tape and reel
Tape and reel
ORDERABLE PART NUMBER
SN74AUC2G07YEPR
_ _ _UV_
SN74AUC2G07YZPR
SN74AUC2G07DBVR
SN74AUC2G07DCKR
U07_
UV_
TOP-SIDE MARKING
(2)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright 漏 2003鈥?005, Texas Instruments Incorporated

SN74AUC2G07DCKRE4 产品属性

  • 3,000

  • 集成电路 (IC)

  • 逻辑 - 缓冲器,驱动器,接收器,收发器

  • 74AUC

  • 缓冲器/线路驱动器,非反相

  • 2

  • 1

  • 9mA,9mA

  • 0.8 V ~ 2.7 V

  • -40°C ~ 85°C

  • 表面贴装

  • 6-TSSOP,SC-88,SOT-363

  • SC-70-6

  • 带卷 (TR)

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