STMicroelectronics unique 鈥淪ingle Feature Size鈩⑩€?/div>
strip-based process. The resulting transistor shows
extremely high packing density for low on-
resistance, rugged avalanche characteristics and
less critical alignment steps therefore a remarkable
manufacturing reproducibility.
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
s
BATTERY MANAGMENT IN NOMADIC
EQUIPMENT
s
POWER MANAGMENT IN CELLULAR PHONES
MOSFET ABSOLUTE MAXIMUM RATINGS
Symbol
V
DS
V
DGR
V
GS
I
D
I
DM
(
q
)
P
TOT
Parameter
Drain-source Voltage (V
GS
= 0)
Drain-gate Voltage (R
GS
= 20 k鈩?
Gate- source Voltage
Drain Current (continuos) at T
C
= 25掳C Single Operation
Drain Current (continuos) at T
C
= 100掳C Single Operation
Drain Current (pulsed)
Total Dissipation at T
C
= 25掳C Dual Operation
Total Dissipation at T
C
= 25掳C Single Operation
Value
20
20
卤 12
2
1.26
8
1.6
2
Unit
V
V
V
A
A
A
W
W
(
q
)Pulse width limited by safe operating area
.
Note: For the P-CHANNEL MOSFET actual polarity of Voltages
and current has to be reversed
August 2001
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