铮?/div>
Upgrade Path for 4-, 8-, 16-, and 32-
Mbit Densities
ETOX鈩?VI (0.25
碌)
Flash Technology
n
n
n
n
n
n
n
n
n
n
The Smart 3 Advanced Boot Block, manufactured on Intel鈥檚 latest 0.25 碌 technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and
interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single
device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective,
monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-
lead and 48-lead TSOP and 48-ball 碌BGA* packages. Additional information on this product family can be
obtained by accessing Intel鈥檚 WWW page: http://www.intel.com/design/flash.
July 1998
Order Number: 290580-005