鈥?/div>
Pb鈭扚ree Packages are Available
8
8
1
Micro8E
DM SUFFIX
CASE 846A
Cathode 1
N/C 2
N/C 3
N/C 4
(Top
View)
8 Reference
7 N/C
6 Anode
5 N/C
SOIC鈭?
D SUFFIX
CASE 751
1
Cathode 1
Anode
2
3
N/C 4
(Top View)
8
7
6
5
Reference
Anode
N/C
This is an internally modified SOIC鈭? package. Pins 2, 3, 6 and
7 are electrically common to the die attach flag. This internal
lead frame modification increases power dissipation capability
when appropriately mounted on a printed circuit board. This
modified package conforms to all external dimensions of the
standard SOIC鈭? package.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 13 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 15 of this data sheet.
漏
Semiconductor Components Industries, LLC, 2005
1
March, 2005 鈭?Rev. 21
Publication Order Number:
TL431/D